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PCB Design Service

  • Price:

    Negotiable

  • minimum:

  • Total supply:

  • Delivery term:

    The date of payment from buyers deliver within days

  • seat:

    Guangdong

  • Validity to:

    Long-term effective

  • Last update:

    2019-11-28 11:19

  • Browse the number:

    210

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Company Profile

Shenzhen Jingxin Electronic Technology Co., Ltd.

By certification [File Integrity]

Contact: jingxin2019(Mr.)  

Email:

Telephone:

Phone:

Area: Guangdong

Address: Guangdong

Website: http://www.pcbassemblyems.com/ http://www.hlzygz.com/com/jingxin2019/

Product details

PCB Design Service

1. We offer One-shop PCAB/PCB manufacturing service

2.10 year of pcb design service and turnkey ODM/OEM experience

3. We can provide F4B,F4BK, Teconic,Arlon,Rogers materia PCB

4. Timely customizations PCBs and PCBAs


Detailed Terms

Technical requirement:

1) Professional Surface-mounting and Through-hole soldering Technolog

2) Various sizes like 1206,0805,0603 components SMT technology

3) ICT(In Circuit Test),FCT(Functional Circuit Test) technology.

4) PCB Assembly With UL,CE,FCC,Rohs Approval

5) Nitrogen gas reflow soldering technology for SMT.

6) High Standard SMT&Solder Assembly Line

7) High density interconnected board placement technology capacity


PCBA Technical Capacity

SMT

Position accuracy: 20 um

Components size: 0.4×0.2mm(01005) —130×79mm,Flip-CHIP,QFP,BGA,POP

Max. component height: 25mm

Max. PCB size: 680×500mm

Min. PCB size: no limited

PCB thickness: 0.3 to 6mm

PCB weight: 3KG

Wave-Solder

Max. PCB width: 450mm

Min. PCB width: no limited

Component height: Top 120mm/Bot 15mm

Sweat-Solder

Metal type: part, whole, inlay, sidestep

Metal material: Copper, Aluminum

Surface Finish: plating Au, plating sliver , plating Sn

Air bladder rate: less than20%

Testing

ICT, Probe flying, burn-in, function test, temperature cycling, AXI – 2D and 3D automated X-ray inspection, AOI – automated optical inspection


PCB Assembly Process

Drilling-----Exposure-----Plating-----Etaching & Stripping-----Punching-----Electrical Testing-----SMT-----Wave Soldering-----Assembling-----ICT-----Function Testing-----Temperature & Humidity Testing


Testing Services

X-Ray (2-D and 3-D)

BGA X-Ray Inspection

AOI Testing (Automated Optical Inspection)

ICT Testing (In-Circuit Testing)

Functional Testing (at the board & system level)

Flying Probe 


Capabilities

Surface Mount Technology/ Parts (SMT Assembly)

Through-Hole Device/ Parts (THD)

Mixed Parts: SMT & THD assembly

BGA/ Micro BGA/ uBGA

QFN, POP & lead-less chips

2800 pin-count BGA

0201/ 1005 passive components

0.3/ 0.4 Pitch

PoP Package

Flip-chip under-filled CCGA

BGA Interposer/ Stack-up


FAQ

http://www.pcbassemblyems.com/